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9780081002186 - Suryadevara Babu: Advances in Chemical Mechanical Planarization (CMP) - Book
1
Suryadevara Babu (?):

Advances in Chemical Mechanical Planarization (CMP) (?)

Delivery from: NetherlandsBook is in english languageNew bookeBook, e-Book, digital book

ISBN: 9780081002186 (?) or 0081002181, in english, Woodhead Publishing, New, ebook

198.44(without obligation)
Direct beschikbaar
bol.com
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography... Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.Considers techniques and processes for CMP of dielectric and metal filmsIncludes chapters devoted to CMP for particular materialsAddresses consumables and process control for improved CMP Productinformatie:Taal: Engels;Formaat: ePub met kopieerbeveiliging (DRM) van Adobe;Kopieerrechten: Het kopiëren van (delen van) de pagina's is niet toegestaan ;Geschikt voor: Alle e-readers te koop bij bol.com (of compatible met Adobe DRM). Telefoons/tablets met Google Android (1.6 of hoger) voorzien van bol.com boekenbol app. PC en Mac met Adobe reader software;ISBN10: 0081002181;ISBN13: 9780081002186;Product breedte: 152 mm;Product hoogte: 71 mm;Product lengte: 229 mm; Engels | Ebook
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seller comment bol.com:
Nieuw, Direct beschikbaar
Platform order number Bol.com: 9200000054680778
Category: School en studie, Techniek en technologie, Elektronica /, School en studie, Techniek en technologie, Materiaalkunde
Data from 06/09/2016 15:56h
ISBN (alternative notations): 0-08-100218-1, 978-0-08-100218-6